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<span style="font-family: helvetica; font-size: 12pt;">Tom,</span>
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<span style="font-family: helvetica; font-size: 12pt;">for all sort of useful information about the RX888 (including problems with heat dissipation and thermal pads) I recommend that you search the RX888 discussion board in the SDR Console forum: <a href="https://forum.sdr-radio.com:4499/viewforum.php?f=57">https://forum.sdr-radio.com:4499/viewforum.php?f=57</a> where you'll find other user experiences, their measurements, and what they have tried to alleviate this problem.</span>
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<span style="font-family: helvetica; font-size: 12pt;">Franco</span>
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On 07/26/2023 2:04 PM EDT Tom McDermott via TangerineSDR <tangerinesdr@lists.tapr.org> wrote:
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Hi All - some speculation about the RX888 failures.
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My RX888 unit does not seem to get warm when running. One would think that the thermal pads would
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conduct the heat out of the chips and to the case.
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Normally thermal pads are designed to be applied to the top of the hot IC, then the heatsink pressed
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against it. That squishes the thermal pad and causes it to fill any gaps between the IC and the metal heatsink.
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On Monday's zoom session it looked like the PC board is slid into the case rather than having the top pushed down onto
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the IC. If so, the thermal pad may not be making good thermal contact to the case. This might explain
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why the case seems so cold.
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Perhaps if the Cypress IC overheats it might fail?
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Does anyone have experience with a case getting warm / hot and the failure occurring? This would
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be a contraindication to this theory.
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-- Tom, N5EG
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<br>TangerineSDR mailing list
<br>TangerineSDR@lists.tapr.org
<br>http://lists.tapr.org/mailman/listinfo/tangerinesdr_lists.tapr.org
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